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"Impact of Interconnect Pattern Density Information on a 90nm Technology ..."

Payman Zarkesh-Ha et al. (2003)

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DOI: 10.1109/ISQED.2003.1194767

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  - https://dblp.org/rec/conf/isqed/Zarkesh-HaLDLW03
Payman Zarkesh-Ha, S. Lakshminarayann, Ken Doniger, William Loh, Peter Wright:
Impact of Interconnect Pattern Density Information on a 90nm Technology ASIC Design Flow. ISQED 2003: 405-409

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