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"High-performance RF-interconnect for 3D stacked memory."
Ahmed Alzahmi et al. (2017)
- Ahmed Alzahmi, Nahid Mirzaie, Chung-Ching Lin, Insoo Kim, Gyung-Su Byun:
High-performance RF-interconnect for 3D stacked memory. ISOCC 2017: 109-110
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