default search action

combined dblp search
author search
venue search
publication search

ask others

"Direct Cu-polyimide Bonding Achieved by Surface Activation and ..."

Ying Meng et al. (2021)

> Home

Details and statistics

DOI: 10.1109/ICTA53157.2021.9661693

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icta3/MengGWCHWWML21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icta3/MengGWCHWWML21
Ying Meng, Runhua Gao, Xinhua Wang, Xiaojuan Chen, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu, Xinyu Liu:
Direct Cu-polyimide Bonding Achieved by Surface Activation and Pt-catalyzed Formic Acid Atmosphere. ICTA 2021: 201-203

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.