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"Thermal modeling and design on smartphones with heat pipe cooling technique."

Hong-Wen Chiou et al. (2017)

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DOI: 10.1109/ICCAD.2017.8203816

access: closed

type: Conference or Workshop Paper

metadata version: 2018-04-09

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  dblp key:
  - conf/iccad/ChiouLHC17
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/ChiouLHC17
Hong-Wen Chiou, Yu-Min Lee, Hsuan-Hsuan Hsiao, Liang-Chia Cheng:
Thermal modeling and design on smartphones with heat pipe cooling technique. ICCAD 2017: 482-489

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