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"Co-optimization of TSV assignment and micro-channel placement for 3D-ICs."

Bing Shi, Caleb Serafy, Ankur Srivastava (2013)

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DOI: 10.1145/2483028.2483131

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-18

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Bing Shi, Caleb Serafy, Ankur Srivastava:
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 337-338

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