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"Muffin: A Framework Toward Multi-Dimension AI Fairness by Uniting ..."

Yi Sheng et al. (2023)

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DOI: 10.1109/DAC56929.2023.10247765

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-21

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  - conf/dac/ShengYYSHJ23
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  - https://dblp.org/rec/conf/dac/ShengYYSHJ23
Yi Sheng, Junhuan Yang, Lei Yang, Yiyu Shi, Jingtong Hu, Weiwen Jiang:
Muffin: A Framework Toward Multi-Dimension AI Fairness by Uniting Off-the-Shelf Models. DAC 2023: 1-6

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