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"BEOL Interconnect Innovation: Materials, Process and Systems ..."
Gaurav Thareja et al. (2023)
- Gaurav Thareja, Ashish Pal, Xingye Wang, Sefa Dag, Shi You, Shashank Sharma, Qing Zhu, Carmen L. Cervantes, Shinjae Hwang, Matthew Spuller, Ben Ng, Pradeep S. Kumar, Norman Tam, Max Gage, Sameer Deshpande, Zhiyuan Wu, Alexander Jansen, Liton Dey, Feng Chen, Xianjin Xie, Keyvan Kashefizadeh, Vinod Reddy, Andy Lo, Zhebo Chen, Sidney Huey, Jianshe Tang, He Ren, Mehul Naik, Brian Brown, Sree Kesapragada, Buvna Ayyagari-Sangamalli, El Mehdi Bazizi, Xianmin Tang:
BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. VLSI Technology and Circuits 2023: 1-2
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