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"Die to wafer 3D stacking for below 10um pitch microbumps."

Jaber Derakhshandeh et al. (2016)

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DOI: 10.1109/3DIC.2016.7969993

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/3dic/DerakhshandehHP16
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  - https://dblp.org/rec/conf/3dic/DerakhshandehHP16
Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller:
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4

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