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Herbert Reichl
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2010 – 2019
- 2011
- [j10]Thomas Schreier-Alt, Frank Rehme, Frank Ansorge, Herbert Reichl:
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds. Microelectron. Reliab. 51(3): 668-675 (2011) - 2010
- [j9]Bernhard Wunderle
, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50(7): 900-909 (2010)
2000 – 2009
- 2009
- [c10]Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle
3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8 - [c9]M. Niedermayer, C. Richter, J. Hefer, Stephan Guttowski, Herbert Reichl:
SENESCOPE: A design tool for cost optimization of wireless sensor nodes. IPSN 2009: 313-324 - [c8]Rene Vieroth, Thomas Löher, Manuel Seckel, Christian Dils
Stretchable Circuit Board Technology and Application. ISWC 2009: 33-36 - [c7]Herbert Reichl, Ivan N. Ndip:
Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes. MBMV 2009: 1-2 - 2008
- [i3]Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari:
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array. CoRR abs/0802.3082 (2008) - [i2]Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl:
Technologies for 3D Heterogeneous Integration. CoRR abs/0805.0917 (2008) - [i1]Robert Hahn, Stefan Wagner, Steffen Krumbholz, Herbert Reichl:
Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators. CoRR abs/0805.0939 (2008) - 2006
- [j8]Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl:
High-temperature reliability of Flip Chip assemblies. Microelectron. Reliab. 46(1): 144-154 (2006) - [c6]Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. BSN 2006: 23-26 - [c5]Andre Lissner, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl:
Vorhersage von magnetischen Kopplungen in Filterschaltungen. EMV 2006: 173-180 - [c4]Stefan-Peter Weber, André Linde, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl:
Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV. EMV 2006: 655-664 - [c3]M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl:
Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. IPSN 2006: 391-398 - 2005
- [j7]A. Ege Engin
Closed-form network representations of frequency-dependent RLGC parameters. Int. J. Circuit Theory Appl. 33(6): 463-485 (2005) - [j6]Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl:
Characterization of bump arrays at RF/microwave frequencies. Microelectron. Reliab. 45(3-4): 551-558 (2005) - [j5]Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl:
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. Microelectron. Reliab. 45(9-11): 1672-1675 (2005) - [c2]Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. ISWC 2005: 86-91 - [p1]Christine Kallmayer
Packaging Challenges in Miniaturization. Ambient Intelligence 2005: 327-348 - 2004
- [j4]Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
Long time reliability study of soldered flip chips on flexible substrates. Microelectron. Reliab. 44(2): 309-314 (2004) - [j3]Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl:
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectron. Reliab. 44(5): 797-803 (2004) - [j2]Bernhard Wunderle
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44(12): 1933-1945 (2004) - 2002
- [j1]Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl:
Bump formation for flip chip and CSP by solder paste printing. Microelectron. Reliab. 42(3): 391-398 (2002)
1990 – 1999
- 1999
- [c1]Robert Hahn, Herbert Reichl:
Batteries and Power Supplies for Wearable and Ubiquitous Computing. ISWC 1999: 168-169
Coauthor Index
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