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Nick M. Ridler
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2020 – today
- 2024
- [j22]Minjie Shu
, Xiaobang Shang
Improvements to Millimeter-Wave Dielectric Measurement Using Material Characterization Kit (MCK). IEEE Trans. Instrum. Meas. 73: 1-8 (2024) - [j21]Manoj Stanley
Characterizing S-Parameters of Microwave Coaxial Devices With up to Four Ports at Temperatures of 3 K and Above for Quantum Computing Applications. IEEE Trans. Instrum. Meas. 73: 1-6 (2024) - [c2]Dilbagh Singh, Martin J. Salter, Nick M. Ridler:
Characterisation of Power Transistors for Wireless Network Applications Using Passive and Active Load-Pull. M&N 2024: 1-5 - 2023
- [j20]Roshan Payapulli, Liyan Zhu
Polymer-Based 3-D Printed 140 to 220 GHz Metal Waveguide Thru Lines, Twist and Filters. IEEE Access 11: 32272-32295 (2023) - [j19]Manoj Stanley
Determination of the Permittivity of Transmission Lines at Milli-Kelvin Temperatures. IEEE Access 11: 60626-60634 (2023) - [j18]Liyan Zhu
3-D Printed THz Waveguide Components. IEEE Access 11: 79073-79086 (2023) - 2022
- [j17]Liyan Zhu
3-D Printing Quantization Predistortion Applied to Sub-THz Chained-Function Filters. IEEE Access 10: 38944-38963 (2022) - [j16]Sang-Hee Shin
3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems. IEEE Access 10: 41708-41719 (2022) - [j15]Manoj Stanley
Characterizing Scattering Parameters of Superconducting Quantum Integrated Circuits at Milli-Kelvin Temperatures. IEEE Access 10: 43376-43386 (2022) - [j14]Dilbagh Singh, Martin J. Salter, Susan Johny, Nick M. Ridler:
Uncertainties in Small-Signal and Large-Signal Measurements of RF Amplifiers Using a VNA. IEEE Instrum. Meas. Mag. 25(6): 37-44 (2022) - 2021
- [j13]Sang-Hee Shin
Polymer-Based 3-D Printed 140-220 GHz Low-Cost Quasi-Optical Components and Integrated Subsystem Assembly. IEEE Access 9: 28020-28038 (2021) - [j12]Enrique Marquez-Segura
Microwave Characterization of Conductive PLA and Its Application to a 12 to 18 GHz 3-D Printed Rotary Vane Attenuator. IEEE Access 9: 84327-84343 (2021) - [j11]Dongdong Ma
Assessing the Impact of Data Filtering Techniques on Material Characterization at Millimeter-Wave Frequencies. IEEE Trans. Instrum. Meas. 70: 1-4 (2021) - 2020
- [j10]Yi Wang
Characterization of Dielectric Materials at WR-15 Band (50-75 GHz) Using VNA-Based Technique. IEEE Trans. Instrum. Meas. 69(7): 4930-4939 (2020) - [c1]Demos Serghiou
Ultra-Wideband Terahertz Channel Propagation Measurements from 500 to 750 GHz. UCET 2020: 1-4
2010 – 2019
- 2019
- [j9]Jingye Sun, Attique Dawood, William J. Otter, Nick M. Ridler, Stepan Lucyszyn
Microwave Characterization of Low-Loss FDM 3-D Printed ABS With Dielectric-Filled Metal-Pipe Rectangular Waveguide Spectroscopy. IEEE Access 7: 95455-95486 (2019) - [j8]Sang-Hee Shin
Polymer-Based 3-D Printed Ku-Band Steerable Phased-Array Antenna Subsystem. IEEE Access 7: 106662-106673 (2019) - [j7]Yasameen F. Azeez
Establishing a New Form of Primary Impedance Standard at Millimeter-Wave Frequencies. IEEE Trans. Instrum. Meas. 68(1): 294-296 (2019) - 2017
- [j6]Mira Naftaly
Metrology State-of-the-Art and Challenges in Broadband Phase-Sensitive Terahertz Measurements. Proc. IEEE 105(6): 1151-1165 (2017) - 2011
- [j5]Masahiro Horibe
Comparison Between NPL and NMIJ of Diameter and Scattering Parameter Measurements of Precision 1.85 mm Coaxial Air Lines. IEEE Trans. Instrum. Meas. 60(7): 2327-2334 (2011)
2000 – 2009
- 2009
- [j4]Masahiro Horibe
Comparison Between Two National Metrology Institutes of Diameters and Characteristic Impedance of Coaxial Air Lines. IEEE Trans. Instrum. Meas. 58(4): 1084-1089 (2009) - 2003
- [j3]Maurice G. Cox, Mark P. Dainton, Nick M. Ridler, Martin J. Salter, P. R. Young:
An interpolation scheme for precision intermediate frequency reflection coefficient measurement. IEEE Trans. Instrum. Meas. 52(1): 27-37 (2003) - [j2]Richard A. Dudley, Nick M. Ridler:
Traceability via the Internet for microwave measurements using vector network analyzers. IEEE Trans. Instrum. Meas. 52(1): 130-134 (2003) - [j1]Andrew G. Morgan, Nick M. Ridler, Martin J. Salter:
Generalized adaptive calibration schemes for precision RF vector network analyzer measurements. IEEE Trans. Instrum. Meas. 52(4): 1266-1272 (2003)
Coauthor Index
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