default search action
Fengjuan Wang
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
Person information
Refine list
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2020 – today
- 2024
- [j37]Meng Pang
, Fengjuan Wang, Zhe Li
Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs. Appl. Soft Comput. 157: 111538 (2024) - [j36]Zhaoqilin Yang
EPK-CLIP: External and Priori Knowledge CLIP for action recognition. Expert Syst. Appl. 252: 124183 (2024) - [j35]Fengjuan Wang, Jilin Kou, Xiangkun Yin
A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. 144: 106067 (2024) - [c9]Ruonan Zhang
Synergetic Prototype Learning Network for Unbiased Scene Graph Generation. ACM Multimedia 2024: 945-954 - 2023
- [j34]Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang:
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express 20(10): 20230116 (2023) - [j33]Fengjuan Wang, Ying Lu, Xiangkun Yin
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. 138: 105837 (2023) - 2022
- [j32]Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang:
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express 19(3): 20210515 (2022) - [j31]Xiangkun Yin, Jingyu Lu, Fengjuan Wang:
Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express 19(5): 20210559 (2022) - [j30]Fengjuan Wang, Quan Peng, Ningmei Yu, Yuan Yang:
TSV-based SIW bandpass filter for W-band mobile communication applications. IEICE Electron. Express 19(12): 20220187 (2022) - [j29]Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. 119: 105317 (2022) - [j28]Fengjuan Wang
Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. 129: 105580 (2022) - [j27]Fengjuan Wang
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. 30(7): 989-992 (2022) - 2021
- [j26]Fengjuan Wang
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access 9: 132078-132083 (2021) - [j25]Fengjuan Wang, Baoju Zhang, Cuiping Zhang, Wenrui Yan, Zhiyang Zhao, Man Wang:
Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex. Ad Hoc Networks 113: 102398 (2021) - [j24]Zhiyang Zhao, Baoju Zhang, Bo Zhang, Cuiping Zhang, Man Wang, Wenrui Yan, Fengjuan Wang:
A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR. Ad Hoc Networks 115: 102454 (2021) - [j23]Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang:
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18(15): 20210247 (2021) - [j22]Xiangkun Yin, Fengjuan Wang:
Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express 18(18): 20210319 (2021) - [j21]Fengjuan Wang
A transformer with high coupling coefficient and small area based on TSV. Integr. 81: 211-220 (2021) - [j20]Xiangkun Yin
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116: 105217 (2021)
2010 – 2019
- 2019
- [j19]Baoju Zhang
Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning. IEEE Access 7: 29277-29284 (2019) - [j18]Chengcheng Zhang, Baoju Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang:
A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image. EURASIP J. Wirel. Commun. Netw. 2019: 209 (2019) - [j17]Fengjuan Wang, He Li, Ningmei Yu:
Investigation on impact of substrate on low-pass filter based on coaxial TSV. IEICE Electron. Express 16(2): 20180992 (2019) - [j16]Fengjuan Wang, Jia Huang, Ningmei Yu:
A high-pass filter based on through-silicon via (TSV). IEICE Electron. Express 16(10): 20190098 (2019) - [j15]Xianjin Liu
Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response. Sensors 19(16): 3613 (2019) - [c8]Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang:
Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection. CSPS 2019: 520-528 - [c7]Baoju Zhang, Fengjuan Wang, Gang Li, Cuiping Zhang, Chengcheng Zhang:
A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator. CSPS 2019: 1298-1307 - 2018
- [j14]Fengjuan Wang, Hongjun Cao:
Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model. Commun. Nonlinear Sci. Numer. Simul. 56: 481-489 (2018) - [j13]Fengjuan Wang, Jia Huang, Ningmei Yu:
A novel guard method of through-silicon-via (TSV). IEICE Electron. Express 15(11): 20180421 (2018) - [c6]Andrew Placona, Fengjuan Wang, Rich King:
Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends. AMIA 2018 - 2017
- [j12]Fengjuan Wang, Gang Wang, Ningmei Yu:
Equivalent circuit model of through-silicon-via in slow wave mode. IEICE Electron. Express 14(22): 20171025 (2017) - [j11]Fengjuan Wang
An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25(3): 1164-1167 (2017) - [c5]Andrew Placona, Fengjuan Wang, Shantanu Phatakwala, Nick Toure:
Data Munging Tricks Can Build Better High Risk Maternity Predictive Models. AMIA 2017 - 2016
- [j10]Fengjuan Wang, Ningmei Yu:
Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC). IEICE Electron. Express 13(11): 20151117 (2016) - [j9]Fengjuan Wang, Ningmei Yu:
Explicit model of thermal stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 13(21): 20160767 (2016) - 2015
- [j8]Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang:
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12(14): 20150434 (2015) - [j7]Fengjuan Wang, Ningmei Yu:
Study on thermal stress and keep-out zone induced by Cu and SiO2 filled coaxial-annular through-silicon via. IEICE Electron. Express 12(22): 20150844 (2015) - [j6]Shigang Wang, Yong Yan, Fengjuan Wang, Guanxiong Wu:
Based on reverse molding technology of the impeller of the fluid dynamics analysis. J. Comput. Methods Sci. Eng. 15(2): 183-192 (2015) - [c4]Jie Jin, Hui Liu, Fengjuan Wang, Hong Peng, Jun Wang:
Parallel Implementation of P Systems for Data Clustering on GPU. BIC-TA 2015: 200-211 - 2014
- [j5]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45(2): 205-210 (2014) - 2013
- [j4]Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding:
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10(14): 20130449 (2013) - [j3]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10(20): 20130666 (2013) - [j2]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding:
Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10(24): 20130894 (2013) - [j1]Shigang Wang, Fangfang Zhou, Fengjuan Wang:
Effect of Inertia Weight w on PSO-SA Algorithm. Int. J. Online Biomed. Eng. 9(S6): 87-91 (2013) - 2011
- [c3]Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang:
A thermal model for the top layer of 3D integrated circuits considering through silicon vias. ASICON 2011: 618-620 - [c2]Fengjuan Wang, Zhihua Xie:
Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock. ICEIS (4) 2011: 600-605
2000 – 2009
Coauthor Index
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from ,
, and
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and
to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from .
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-11-07 20:34 CET by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by: