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Jui-Han Liu

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2020 – today

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2022
[c2]
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  dblp key:
  - conf/vlsit/HongLHHWCLC22
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  - https://dblp.org/rec/conf/vlsit/HongLHHWCLC22
Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen:
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. VLSI Technology and Circuits 2022: 387-388

2010 – 2019

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2019
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  - conf/3dic/LeeCLIKCO19
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Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba:
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC 2019: 1-4

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