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Matthias Blaicher
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2020 – today
- 2022
- [c9]Pascal Maier, Yilin Xu, Matthias Lauermann, Alexandra Henniger-Ludwig, Hermann Kapim, Mareike Trappen, Torben Kind, Achim Weber, Matthias Blaicher, Philipp-Immanuel Dietrich, Clemens Wurster, Sebastian Randel, Wolfgang Freude, Christian Koos:
3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly. OFC 2022: 1-3 - 2020
- [c8]Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Muhammad Rodlin Billah, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos:
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. OFC 2020: 1-3
2010 – 2019
- 2019
- [i1]Aleksandar Nesic
, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos:
Hybrid 2D/3D photonic integration for non-planar circuit topologies. CoRR abs/1901.08309 (2019) - 2018
- [c7]Tobias Hoose, Matthias Blaicher, Juned N. Kemal
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting. ECOC 2018: 1-3 - [c6]Christian Koos, Wolfgang Freude
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production. ECOC 2018: 1-2 - [c5]Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos:
3D-Printed Optics for Wafer-Scale Probing. ECOC 2018: 1-3 - [c4]Christian Koos
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics. ICTON 2018: 1-2 - 2017
- [c3]Muhammad Rodlin Billah, Juned N. Kemal
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. ECOC 2017: 1-3 - [c2]Muhammad Rodlin Billah, Matthias Blaicher, Juned N. Kemal, Tobias Hoose, Heiner Zwickel, Philipp-Immanuel Dietrich, Ute Troppenz, Martin Möhrle, Florian Merget, A. Hofmann, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos:
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. OFC 2017: 1-3 - 2016
- [c1]Tobias Hoose, Muhammad Rodlin Billah, Matthias Blaicher, Pablo Marin, Philipp-Immanuel Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, Jörg Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos:
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC 2016: 1-3
Coauthor Index
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