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Stephane Azzopardi
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2010 – 2019
- 2019
- [c2]Thilini Wickramasinghe, Stephane Azzopardi, Bruno Allard, Cyril Buttay
, Charles Joubert, Christian Martin, Jean-François Mogniotte, Hervé Morel, Pascal Bevilacqua, Thanh-Long Le:
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices. IECON 2019: 1573-1578 - [c1]Bertrand Revol, Stephane Azzopardi, Toni Youssef, Jean Sylvio Ngoua Teu, Cyrille Gautier, Rabih Khazaka, Sara Roggia:
Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP) systems. IECON 2019: 7128-7134 - 2018
- [j18]Tien Anh Nguyen, Stéphane Lefebvre, Stephane Azzopardi:
Effect of short circuit aging on safe operating area of SiC MOSFET. Microelectron. Reliab. 88-90: 645-651 (2018) - 2015
- [j17]Eric Woirgard
Identification and analysis of power substrates degradations subjected to severe aging tests. Microelectron. Reliab. 55(9-10): 1961-1965 (2015) - [j16]F. Baccar, Houssam Arbess
Ageing mechanisms in Deep Trench Termination (DT2) Diode. Microelectron. Reliab. 55(9-10): 1981-1987 (2015) - [j15]Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard:
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectron. Reliab. 55(9-10): 1997-2002 (2015) - [j14]Houssam Arbess
Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material. Microelectron. Reliab. 55(9-10): 2017-2021 (2015) - 2013
- [j13]Wissam Sabbah, Stephane Azzopardi, Cyril Buttay
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53(9-11): 1617-1621 (2013) - [j12]F. Baccar, Stephane Azzopardi, L. Théolier
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach. Microelectron. Reliab. 53(9-11): 1719-1724 (2013) - 2012
- [j11]François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet:
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization. Microelectron. Reliab. 52(9-10): 2321-2325 (2012) - 2010
- [j10]Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature. Microelectron. Reliab. 50(9-11): 1815-1821 (2010)
2000 – 2009
- 2009
- [j9]Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectron. Reliab. 49(9-11): 1370-1374 (2009) - [j8]Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard:
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation. Microelectron. Reliab. 49(9-11): 1398-1403 (2009) - 2007
- [j7]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions. Microelectron. Reliab. 47(9-11): 1730-1734 (2007) - [j6]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation. Microelectron. Reliab. 47(9-11): 1800-1805 (2007) - 2006
- [j5]Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard:
Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectron. Reliab. 46(9-11): 1778-1783 (2006) - 2005
- [j4]Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard:
Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectron. Reliab. 45(9-11): 1700-1705 (2005) - 2004
- [j3]Walid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles. Microelectron. Reliab. 44(9-11): 1769-1773 (2004) - 2003
- [j2]Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectron. Reliab. 43(9-11): 1901-1906 (2003) - 2001
- [j1]Stephane Azzopardi, Atsuo Kawamura
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs. Microelectron. Reliab. 41(9-10): 1731-1736 (2001)
Coauthor Index
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