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23rd SLIP 2021: Munich, Germany
- ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2021, Munich, Germany, November 4, 2021. IEEE 2021, ISBN 978-1-6654-0083-1
- Tanay Karnik:
Recent Advances and Future Challenges in 2.5D/3D Heterogeneous Integration (Invited). x - Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes:
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. 1-7 - Chung-Kuan Cheng, Chia-Tung Ho, Chester Holtz, Bill Lin:
Design and System Technology Co-Optimization Sensitivity Prediction for VLSI Technology Development using Machine Learning. 8-15 - Suresh Ramalingam:
Enabling Chiplet Integration Beyond 7nm (Invited). 16 - Giuliano Sisto
, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited). 17-23 - Makoto Nagata:
Chip Stacking and Packaging Technology Explorations for Hardware Security (Invited). 24 - Minmin Jiang, Vasilis F. Pavlidis:
Performance-Aware Interconnect Delay Insertion Against EM Side-Channel Attacks. 25-32 - Giovanna Calò, Marina Barbiroli, Gaetano Bellanca, Davide Bertozzi, Franco Fuschini, Velio Tralli, Giovanni Serafino, Vincenzo Petruzzelli:
Reconfigurable on-chip wireless interconnections through optical phased arrays (Invited). 33-40 - Joris Van Campenhout:
Silicon Photonics Technology for Terabit-scale Optical I/O (Invited). 41 - Yvain Thonnart:
Designing a Multi-Chiplet Manycore System using the POPSTAR Optical NoC Architecture (Invited). 42 - Bapi Vinnakota:
The Open Domain-Specific Architecture: An Introduction (Invited). 43 - Babak Sharifpour, Mohammad Sharifpour, Midia Reshadi:
SID-Mesh: Diagonal Mesh Topology for Silicon Interposer in 2.5D NoC with Introducing a New Routing Algorithm. 44-51 - Jitesh Choudhary
RAMAN: Reinforcement Learning Inspired Algorithm for Mapping Applications onto Mesh Network-on-Chip. 52-58 - Tiago Mück:
Network-on-Chips for Future 3D Stacked Dies (Invited). 59
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