Semiconductor chip’s quality analysis based on its high dimensional test data
Crossref DOI link: https://doi.org/10.1007/s10479-019-03240-z
Published Online: 2019-05-14
Published Print: 2022-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kai, Sun
Jin, Wu
Funding for this research was provided by:
National Science and Technology Major Project of China (2016ZX03001002)
Text and Data Mining valid from 2019-05-14
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Article History
First Online: 14 May 2019