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RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
/ Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.-
2024 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
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Beam-based commissioning of a novel X-band transverse deflection structure with variable polarization
/ González Caminal, P (DESY) ; Christie, F (DESY) ; D'Arcy, R (DESY) ; Jaster-Merz, S M (DESY) ; Assmann, R (DESY) ; Burkart, F (DESY) ; Conrad, B (DESY) ; Dinter, H (DESY) ; Foese, M (DESY) ; Herrmann, J (DESY) et al.
Longitudinal electron-beam diagnostics play a critical role in the operation and control of x-ray free-electron lasers, which rely on parameters such as the current profile, the longitudinal phase space, or the slice emittance of the particle distribution. On the one hand, the femtosecond-scale electron bunches produced at these facilities impose stringent requirements on the resolution achievable with the diagnostics. [...]
2024 - 19 p.
- Published in : Phys. Rev. Accel. Beams 27 (2024) 032801
Fulltext: PDF;
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The PolariX-TDS Project: Bead-Pull Measurements and High-Power Test on the Prototype
/ Craievich, Paolo (PSI, Villigen) ; Aßmann, Ralph (DESY) ; Bopp, Markus (PSI, Villigen) ; Braun, Hans-Heinrich (PSI, Villigen) ; Catalán Lasheras, Nuria (CERN) ; Christie, Florian (DESY) ; Citterio, Alessandro (PSI, Villigen) ; D'Arcy, Richard (DESY) ; Dorda, Ulrich (DESY) ; Foese, Manon (DESY) et al.
A collaboration between DESY, PSI and CERN has been established to develop and build an advanced modular X- band transverse deflection structure (TDS) system with the new feature of providing variable polarization of the deflecting force. The prototype of the novel X-band TDS, the Polarizable X-band (PolariX) TDS, was fabricated at PSI following the high-precision tuning-free production process developed for the C-band Linac of the SwissFEL project. [...]
2019 - 4 p.
- Published in : 10.18429/JACoW-FEL2019-WEP036
Fulltext: PDF;
In : 39th International Free Electron Laser Conference, Hamburg, Germany, 26 - 30 Aug 2019, pp.WEP036
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Experimental demonstration of novel beam characterization using a polarizable X-band transverse deflection structure
/ Marchetti, B (DESY ; European XFEL, Hamburg) ; Grudiev, A (CERN) ; Craievich, P (PSI, Villigen) ; Assmann, R (DESY) ; Braun, H H (PSI, Villigen) ; Catalan Lasheras, N (CERN) ; Christie, F (DESY) ; D'Arcy, R (DESY) ; Fortunati, R (PSI, Villigen) ; Ganter, R (PSI, Villigen) et al.
The PolariX TDS (Polarizable X-Band Transverse Deflection Structure) is an innovative TDS-design operating in the X-band frequency-range. The design gives full control of the streaking plane, which can be tuned in order to characterize the projections of the beam distribution onto arbitrary transverse axes. [...]
2021 - 14 p.
- Published in : Sci. Rep. 11 (2021) 3560
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BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades
/ Daas, Michael (Bonn U.) ; Dieter, Yannick (Bonn U.) ; Dingfelder, Jochen (Bonn U.) ; Frohne, Markus (Bonn U.) ; Giakoustidis, Georgios (Bonn U.) ; Hemperek, Tomasz (Bonn U.) ; Hinterkeuser, Florian (Bonn U.) ; Hügging, Fabian (Bonn U.) ; Janssen, Jens (Bonn U.) ; Krüger, Hans (Bonn U.) et al.
BDAQ53 is a readout system and verification framework for hybrid pixel detector readout chips of the RD53 family. These chips are designed for the upgrade of the inner tracking detectors of the ATLAS and CMS experiments. [...]
arXiv:2005.11225.-
2021-01-11 - 6 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 986 (2021) 164721
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Novel $X$ -band transverse deflection structure with variable polarization
/ Craievich, P (PSI, Villigen) ; Bopp, M (PSI, Villigen) ; Braun, H H (PSI, Villigen) ; Citterio, A (PSI, Villigen) ; Fortunati, R (PSI, Villigen) ; Ganter, R (PSI, Villigen) ; Kleeb, T (PSI, Villigen) ; Marcellini, F (PSI, Villigen) ; Pedrozzi, M (PSI, Villigen) ; Prat, E (PSI, Villigen) et al.
A collaboration between DESY, PSI and CERN has developed and built an advanced modular X-band transverse deflection structure (TDS) system with the new feature of providing variable polarization of the deflecting force. The prototype of the novel X-band TDS, the polarizable $X$-band (PolariX) TDS, was fabricated at PSI following the high-precision tuning-free production process developed for the C-band Linac of the SwissFEL project. [...]
2020 - 22 p.
- Published in : Phys. Rev. Accel. Beams 23 (2020) 112001
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Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC
/ Marconi, S (Marseille, CPPM) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) ; Menouni, M (Marseille, CPPM) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Bomben, M (Paris U., VI-VII) ; Calderini, G (Paris U., VI-VII) et al.
The RD53A large scale pixel demonstrator chip has been developed in 65 nm CMOS technology by the RD53 collaboration, in order to face the unprecedented design requirements of the pixel 2 phase upgrades of the CMS and ATLAS experiments at CERN. This prototype chip is designed to demonstrate that a set of challenging specifications can be met, such as: high granularity (small pixels of 50×50 or 25× 100 µm2) and large pixel chip size (~2x2 cm2), high hit rate (3 GHz/cm2), high readout speed, very high radiation levels (500 Mrad - 1 Grad) and operation with serial powering. [...]
2019 - 4 p.
- Published in : 10.1109/NSSMIC.2018.8824486
In : 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC 2018), Sydney, Australia, 10 - 17 Nov 2018, pp.8824486
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