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1.
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RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
/ Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.-
2024 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
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2.
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Timing resolution performance of Timepix4 bump-bonded assemblies
/ Bolzonella, R. (INFN, Ferrara) ; Alozy, J. (CERN) ; Ballabriga, R. (CERN) ; van Beuzekom, M. (NIKHEF, Amsterdam) ; Biesuz, N.V. (INFN, Ferrara) ; Campbell, M. (CERN) ; Cardarelli, P. (INFN, Ferrara) ; Cavallini, V. (INFN, Ferrara) ; Coco, V. (CERN) ; Cotta Ramusino, A. (INFN, Ferrara) et al.
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. [...]
arXiv:2404.15499.-
2024-07-22 - 24 p.
- Published in : JINST 19 (2024) P07021
Fulltext: document - PDF; 2404.15499 - PDF;
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3.
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Bandgap reference, temperature sensor and low drop-out regulator circuits monolithic sensors in TPSCo 65 nm ISC technology
/ Yelkenci, A. (Nikhef, Amsterdam) ; Qui, S. (Utrecht U.) ; Rossewij, M.J. (Utrecht U.) ; Grelli, A. (Utrecht U.) ; Gajanana, D. (NIKHEF, Amsterdam) ; Gromov, V. (NIKHEF, Amsterdam)
With Inner Tracking System v3 (ITS3), the ALICE experiment is pursuing a wafer-scale Monolithic Active Pixel Sensor (MAPS). The chip is being developed in TPSCo 65 nm ISC technology which is under study in the framework of CERN EP R&D; on monolithic sensors for High Energy Physics (HEP) applications. [...]
2023
- Published in : Journal of Instrumentation 18 (2023) C02017
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4.
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Optimization of a 65 nm CMOS imaging process for monolithic CMOS sensors for high energy physics
/ Rinella, G Aglieri (CERN) ; Andronic, A (Munster U., ITP) ; Antonelli, M (INFN, Trieste ; Trieste U.) ; Baccomi, R (INFN, Trieste ; Trieste U.) ; Ballabriga, R (CERN) ; Barbero, M (Marseille, CPPM) ; Barrillon, P (Marseille, CPPM) ; Baudot, J (Strasbourg, IPHC) ; Becht, P (Heidelberg U.) ; Benotto, F (INFN, Turin ; Turin U.) et al.
The long term goal of the CERN Experimental Physics Department R&D; on monolithic sensorsis the development of sub-100nm CMOS sensors for high energy physics. The first technologyselected is the TPSCo 65nm CMOS imaging technology. [...]
2023 - 15 p.
- Published in : PoS Pixel2022 (2023) 083
Fulltext: PDF;
In : 10th International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.083
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5.
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Development of a Stitched Monolithic Pixel Sensor prototype (MOSS chip) towards the ITS3 upgrade of the ALICE Inner Tracking system
/ Vicente Leitao, P (CERN) ; Aglieri Rinella, G (CERN) ; Bugiel, S (Strasbourg, IPHC) ; Cecconi, L (CERN) ; de Melo, J L A (CERN) ; De Robertis, G (INFN, Bari ; Bari U.) ; Deng, W (CERN ; Hua-Zhong Normal U.) ; Dorda Martin, A (CERN ; KIT, Karlsruhe) ; Dorosz, P (CERN) ; Fang, X (Strasbourg, IPHC) et al.
The MOnolithic Stitched Sensor (MOSS) is a development prototype chip towards the ITS3 vertexing detector for the ALICE experiment at the LHC. Designed using a 65 nm CMOS Imaging technology, it aims at profiting from the stitching technique to construct a single-die monolithic pixel detector of 1.4 cm × 26 cm. [...]
2023 - 8 p.
- Published in : JINST 18 (2023) C01044
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01044
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6.
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7.
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8.
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Model Independent Approach of the JUNO $^8$B Solar Neutrino Program
/ JUNO Collaboration
The physics potential of detecting $^8$B solar neutrinos is exploited at the Jiangmen Underground Neutrino Observatory (JUNO), in a model independent manner by using three distinct channels of the charged-current (CC), neutral-current (NC) and elastic scattering (ES) interactions. [...]
arXiv:2210.08437.
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24 p.
Fulltext
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9.
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Timepix4, a large area pixel detector readout chip which can be tiled on 4 sides providing sub-200 ps timestamp binning
/ Llopart, X (CERN) ; Alozy, J (CERN) ; Ballabriga, R (CERN) ; Campbell, M (CERN) ; Casanova, R (Barcelona, IFAE) ; Gromov, V (Nikhef, Amsterdam) ; Heijne, E H M (CERN ; IEAP CTU, Prague) ; Poikela, T (CERN) ; Santin, E (CERN) ; Sriskaran, V (CERN) et al.
Timepix4 is a 24.7 × 30.0 mm$^{2}$ hybrid pixel detector readout ASIC which has been designed to permit detector tiling on 4 sides. It consists of 448 × 512 pixels which can be bump bonded to a sensor with square pixels at a pitch of 55 µm. [...]
2022 - 15 p.
- Published in : JINST 17 (2022) C01044
Fulltext: PDF;
In : 22nd International Workshop on Radiation Imaging Detectors, Online, 27 Jun - 1 Jul 2021, pp.C01044
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10.
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Timing performance of the Timepix4 front-end
/ Heijhoff, K. (Nikhef, Amsterdam) ; Akiba, K. (Nikhef, Amsterdam) ; Ballabriga, R. (CERN) ; van Beuzekom, M. (Nikhef, Amsterdam) ; Campbell, M. (Nikhef, Amsterdam) ; Colijn, A.P. (Nikhef, Amsterdam) ; Fransen, M. (Nikhef, Amsterdam) ; Geertsema, R. (Nikhef, Amsterdam) ; Gromov, V. (Nikhef, Amsterdam) ; Cudie, X. Llopart (CERN)
A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to-digital converter (TDC) and measure the time-bin sizes by precisely controlling the test-pulse arrival time in steps of 10 ps. [...]
arXiv:2203.15912.-
2022-07-04 - 26 p.
- Published in : JINST
Fulltext: 2203.15912 - PDF; document - PDF;
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