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Article
Report number FERMILAB-PUB-24-0469-PPD
Title RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
Author(s) Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) ; Calderini, G (IJCLab, Orsay) ; Caratelli, A (CERN) ; Christian, D C (Fermilab) ; Christiansen, J (CERN) ; Conti, E (CERN) ; Crescioli, F (IJCLab, Orsay) ; Daas, M (Bonn U.) ; De Robertis, G (INFN, Bari) ; Demaria, N (INFN, Turin ; Turin U.) ; Deptuch, G C (Fermilab) ; Dieter, Y (Bonn U.) ; Dimitrievska, A (LBNL, Berkeley) ; Ding, L (INFN, Padua ; Padua U.) ; Esposito, S (CERN) ; Exarchou, D (CERN) ; Fahim, F (Fermilab) ; Fioriti, A (Milan U. ; INFN, Milan) ; Fougeron, D (Marseille, CPPM) ; Gaioni, L (Bergamo U., Ingengneria Dept. ; INFN, Milan) ; Garcia-Sciveres, M (LBNL, Berkeley) ; Gerardin, S (INFN, Padua ; Padua U.) ; Gnani, D (LBNL, Berkeley) ; Grippo, M (INFN, Turin ; Turin U.) ; Gromov, V (NIKHEF, Amsterdam) ; Hamer, M (Bonn U.) ; Havranek, M (Prague, Tech. U.) ; Heim, T (LBNL, Berkeley) ; Hemperek, T (Bonn U.) ; Hinterkeuser, F (Bonn U.) ; Hoff, J (Fermilab) ; Huiberts, S (Bergen U.) ; Janssen, J (Bonn U.) ; Jara Casas, L M (CERN) ; Jirsa, J (Prague, Tech. U.) ; John, J J (Oxford U.) ; Kampkotter, J (Dortmund U.) ; Karagounis, M (Dortmund U.) ; Khwaira, Y (IJCLab, Orsay) ; Kluit, R (NIKHEF, Amsterdam) ; Krieger, A (LBNL, Berkeley) ; Krueger, H (Bonn U.) ; Lalic, J (CERN) ; Lauritzen, M (Bergen U.) ; Licciulli, F (INFN, Bari) ; Lipton, R (Fermilab) ; Liu, T (Fermilab) ; Lopez Morillo, E (Seville U.) ; Lounis, A (IJCLab, Orsay) ; Luongo, F (INFN, Turin ; Turin U.) ; Magazzu, G (INFN, Pisa) ; Marcisovsky, M (Prague, Tech. U.) ; Marconi, S (CERN) ; Marquez Lasso, F (Seville U.) ; Marzocca, C (Bari Polytechnic) ; Mattiazzo, S (INFN, Padua ; Padua U.) ; Menouni, M (Marseille, CPPM) ; Minuti, M (INFN, Pisa) ; Mironova, M (LBNL, Berkeley) ; Miryala, S (Fermilab) ; Monteil, E (INFN, Turin ; Turin U.) ; Moustakas, K (Bonn U.) ; Muõz Chavero, F (Seville U.) ; Neue, G (Prague, Tech. U.) ; Orfanelli, S (CERN) ; Paccagnella, A (INFN, Padua ; Padua U.) ; Pacher, L (INFN, Turin ; Turin U.) ; Palla, F (INFN, Pisa) ; Palomo Pinto, F R (Seville U.) ; Papadopoulou, A (LBNL, Berkeley) ; Paterno, A (INFN, Turin ; Turin U.) ; Petri, A (Milan U. ; INFN, Milan) ; Placidi, P (INFN, Perugia ; Perugia U.) ; Pohl, D (Bonn U.) ; Pradas, A (Sao Paulo, Inst. Tech. Aeronautics) ; Prydderch, M L (Rutherford) ; Pulli, A (CERN) ; Ratti, L (INFN, Pavia) ; Re, V (Bergamo U., Ingengneria Dept. ; INFN, Milan) ; Rehman, A (Bergen U.) ; Rymaszewski, P (Bonn U.) ; Solal, M C (IJCLab, Orsay) ; Standke, M (Bonn U.) ; Stiller, A (Dortmund U.) ; Strebler, T (Marseille, CPPM) ; Stugu, B (Bergen U.) ; Thomas, S (Rutherford) ; Traversi, G (Bergamo U., Ingengneria Dept. ; INFN, Milan) ; Vogrig, D (INFN, Padua ; Padua U.) ; Vogt, M (Bonn U.) ; Wang, T (Bonn U.) ; Yang, H (LBNL, Berkeley) ; Zdenko, J (Prague, Tech. U.) ; Zimmerman, T (Fermilab)
Publication 2024
Number of pages 5
In: Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In: PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
DOI 10.1016/j.nima.2024.169682 (publication)
Subject category Detectors and Experimental Techniques
Accelerator/Facility, Experiment CERN LHC ; ATLAS
CERN LHC ; CMS
Abstract The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. After a half-scale demonstrator (RD53A) and full scale prototypes of the two ASICs (RD53B-ATLAS and RD53B-CMS), largely used by the two communities to characterize 3D and planar sensors, RD53 developed and submitted to foundry in 2023 the production chips. A general overview of the chip architecture will be described.
Copyright/License publication: © 2024 Elsevier B.V.

Corresponding record in: Inspire


 記錄創建於2024-08-22,最後更新在2024-08-22