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Abstract
| Surface state plays a major role in the crack nucleation process of pure metals in the High-Cycle-Fatigue (HCF) as well as in the Ultra-High-Cycle-Fatigue (UHCF) regime. Therefore, in studies dealing with HCF or UHCF, special attention is paid to the evolution of surface degradation during fatigue life. The accelerating structures of the future Compact Linear Collider (CLIC) under study at CERN will be submitted to a high number of thermal-mechanical fatigue cycles, arising from Radio Frequency (RF) induced eddy currents, causing local superficial cyclic heating. The number of cycles during the foreseen lifetime of CLIC reaches 2x10(11). Fatigue may limit the lifetime of CLIC structures. In order to assess the effects of superficial fatigue, specific tests are defined and performed on polycrystalline Oxygen Free Electronic (OFE) grade Copper, a candidate material for the structures. Surface degradation depends on the orientation of near-surface grains. Copper samples thermally fatigued in two different fatigue experiments, pulsed laser and pulsed RF-heating, underwent postmortem Electron Backscattered Diffraction measurements. Samples fatigued by pulsed laser show the same trend in the orientation-fatigue damage behavior as samples fatigued by pulsed RF-heating. It is clearly observed that surface grains, oriented {[}1 1 1] with respect to the surface, show significantly more damage than surface grains oriented {[}1 0 0]. Results arising from a third fatigue experiment, the ultrasound (US) swinger, are compared to the results of the mentioned experiments. The US swinger is an uniaxial mechanical fatigue test enabling to apply within several days a total number of cycles representative of the life of the CLIC structures, thanks to a high repetition rate of 24 kHz. For comparison, laser fatigue experiments have much lower repetition rates. The dependence of surface degradation on grain orientation of samples tested by the US swinger was monitored during the fatigue life. Results are presented and compared to the ones arising from the two other test methods. |