HOW TO GET LEAD-FREE/ROHS II/REACH STATUS
Lead-Free Product Family Summary
Reach Information
Frequently Asked Questions
Whisker Testing
RoHS II Compliance
Environmental Health and Safety
Lead-Free Product Family Summary
These downloadable Excel files contain detailed information regarding Vishay's lead-free conversion program and Recast RoHS II compliance:
Active Lead-Free Product Family
Capacitor Lead-Free Product Family
Inductor, Connector and Frequency Control Lead-Free Product Family
Resistor and Plasma Display Lead-Free Product Family
Reach Statement
Substances of Very High Concern Status by Product Family
Q. What is Vishay's definition of lead-free plating/finish?
A. There is no intentionally added lead (<1000 PPM as per the JEDEC standard) in the plating/finish.
Q. Does Vishay intend to eliminate lead in other areas of the components?
A. Yes, Vishay is in the process of eliminating lead in other parts of the component. For some technologies there currently is no technical solution to eliminate the lead completely (e.g. High temperature die attach solder). Vishay is working with our suppliers to develop other alternatives. Once these alternatives have been tested and qualified Vishay will alert our customer base.
Q. What is Vishay's lead-free plating/finish conversion strategy?
A. Vishay intends to convert all required products to a lead-free finish. Notification of the conversions will be provided through PCNs. Some product lines will make a complete transition and therefore will not offer a Lead alternative. Conversion status and conversion timing along with lead- and lead-free availability is presented in the Lead-Free Product Family Summary section.
Q. Will parts with lead solder finishes be available after the transition to lead-free?
A. Most products will not be offered in a lead alternative. These products will be specifically identified in the Lead-Free Product Family Summary section.
Q. Are components with lead-free termination finish available now?
A. The majority of Vishay's products are available with lead-free finishes today. The exact product families that are available in a lead-free finish can be seen in the Lead-Free Product Family Summary section. To order these parts please contact your local Sales Office
Q. What lead-free finishes are currently used by Vishay?
A. There are several types of lead-free finishes used by Vishay. The majority of the finishes are the industry standard of 100% tin. The Lead-Free Product Family Summary section provides the finish structure.
Q. How can customers identify Lead-free and RoHS II products?
A. Vishay complies with JEDEC Standard 97 to identify Pb-termination status of its product. In addition, Vishay also applies the words "RoHS II" to reels, ammo packs, shipping boxes, etc that meet EU Directive 2011/65/EU
Vishay Standard Label - Minimum Pack Unit (e.g. Reel)
Vishay Standard Label - Shipping Box
Q. Will Vishay change part numbers for components with lead-free finishes?
A. Yes, Vishay will change the part numbers for all products that are converting to lead-free. Parts that have been lead-free for several years will maintain their current part numbers. A detail list of lead-free part numbers by family is available at the Lead-Free Product Family Summary section.
Q. Are lead-free components compatible with lead soldering temperatures?
A. The majority of Vishay components are backward compatible to 215°C. Any exceptions will be noted in Lead-Free Product Family Summary section.
Q. What tests have been done to qualify lead-free finishes?
A. Moisture Sensitivity (if applicable), Solderability, Resistance to Solder Heat and Whisker Growth are the minimum tests performed to qualify lead-free finishes. Moisture Sensitivity is performed according to J-STD-02B/C or greater. Solderability is performed at 215°C and < 10s for SMDs and 235°C/2s for Through Hole products according to IEC 60068-2; IPC J-STD-002B; EIA/JESD22-B102. These test conditions are used to test backward compatibility. Vishay has recently standardized its whisker testing requirements and those tests can be viewed at Whisker Testing.
Q. Which Solder profile is recommended for components with lead-free finishes?
A. Our goal is to meet the industry standard for Reflow which is mostly defined in IPC/JEDEC J-STD-020 /C or greater which requires a maximum peak of 260°C depending on the component volume. Any exceptions to this profile will be listed in the Lead-Free Product Family Summary section.
In order to verify that both the structure and plating process are robust, Vishay has adopted test procedures that are in alignment with the JEDEC standards JESD201A (Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface) and JESD22-A121 (Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes). Some exceptions may apply (see table).
|
Test |
Conditions |
Time/Cycles |
Conditional Release |
Lot |
Samp |
Acceptance Criteria |
|
Ambient Storage |
20-25°C; 30-80% RH |
4000 hrs |
2000 hrs |
3 |
3 |
<40um Whisker* |
|
Temp/Humidity |
55°C +/-3; 85% RH (+/-5) |
4000 hrs |
2000 hrs |
3 |
3 |
<40um Whisker* |
|
Temp Cycle |
-55°C (+0 -10) to 85°C (+10 -0), 3cyc/hour |
1000 cyc |
500 cyc |
3 |
3 |
<40um Whisker* |
RoHS II Compliance means that in conformity to EU Directive 2011/65/EU of 8 June 2011, the six hazardous and restricted substance in the RoHS II directive, along with 4 phthalates amend in EU Directive 2015/863 on 4th June 2015, outlined in Annex II with maximum concentration values tolerated by weight to homogeneous materials, are not present except for applicable exemptions.
• Lead (0.1%)
• Mercury (0.1%)
• Cadmium (0.01%)
• Hexavalent chromium (0.1%)
• Polybrominated biphenyls (0.1%)
• Polybrominated diphenyl ethers (PBDE) (0.1%)
• Bis(2-Ethylhexyl) phthalate (DEHP) (0.1%)
• Benzyl butyl phthalate (BBP) (0.1%)
• Dibutyl phthalate (DBP) (0.1%)
• Diisobutyl phthalate (DIBP) (0.1%)
Vishay defines homogeneous materials as materials that cannot be mechanically disjointed into different materials. Examples of homogeneous materials are electroplated coating, moulding compound, insulation sleeve, lead frame alloy and bonding wires.