The Carnot Partnership Research Awards, recognising exemplary collaboration between Carnot Network institutes and industry, were presented on 16 October 2024 at the Rendez-vous Carnot. Hydrogen for mobility, massive electricity storage, new materials with remarkable properties, eco-responsible wood construction: these are the fields in which the winners have succeeded in co-constructing innovative solutions with their industrial partners. Each year, the Carnot Network singles out four projects in four different categories and chooses one of them to receive the Carnot Grand Prize.

CEA-Leti offers a competitive Fan-Out Wafer-Level Packaging technology using 8” wafers. Based on the reconstruction of substrates around individual chips, this technology has become an iconic part of any “More than Moore” strategy. This advanced technology has enabled high-potential, multi-chip system-in-packages since the mid-2000s. 
Eliminating the need for intermediate, laminated substrates has enabled the integration of high performance systems with a reduced cost and footprint. It has also paved the way for applications that would have been difficult to address using conventional packaging.

LEUKEMIA 360 will be held on 13 November 2024 at the Centre de Conférence Pierre Mendès France organised bu Carnot OPALE.

Carnot I2C, STAR and 3BCAR are joining forces for the 10th COSMETIC 360, the world innovation trade fair for the perfume and cosmetics industry, to be held in Paris on 16 and 17 October 2024.

Carnot Chimie Balard Cirimat, Icéel, Ingénierie@Lyon, M.I.N.ES, MICA, are taking part in LuxePack 2024 on the 30th September to 2nd October 2024 on a joint stand. 

Carnot CEA List and Thales announce the signature of their new partnership in the field of generative artificial intelligence (AI). Gathered within cortAIx, Thales' AI accelerator for mission-critical systems, the Group's AI research teams will collaborate with those of CEA List to provide sovereign, controlled and trusted AI solutions.