Heterogeneous memories, organized as die-stacked in-package and off-package memory, have been a focus of attention by the computer architects to improve memory bandwidth and capacity. Researchers have explored methods and organizations to optimize ...
Three-dimensional DRAMs (3D-DRAMs) are emerging as a promising solution to address the memory wall problem in computer systems. However, high fabrication cost per bit and thermal issues are the main reasons that prevent architects from using 3D-DRAM ...
Personalized recommendation systems have become a major AI application in modern data centers. The main challenges in processing personalized recommendation inferences are the large memory footprint and high bandwidth requirement of embedding layers. To ...
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