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Clock tree synthesis with methodology of re-use in 3D IC

Published: 03 June 2012 Publication History

Abstract

IP reuse methodology has been used extensively in SoC (System on Chip) design. In this reuse methodology, while design and implementation cost is saved, manufacturing cost is not. To further reduce the cost, this reuse concept has been proposed at mask and die level in three-dimension integrated circuit (3D IC). In order to achieve manufacturing reuse, in this paper, we propose a new methodology to design a global clock tree in 3D IC. The objective is to extend an existing clock tree in 2D IC to 3D IC taking into consideration the wirelength, clock skew and the number of TSVs. Compared with NNG-based method, our proposed method reduces the wirelength of the new die and skew of the global 3D clock tree, on an average, 47.16% and 5.85%, respectively.

References

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C. S. Tan, Ronald J. Gutmann, and L. Rafael Reif, "Wafer Level 3-D ICs Process Technology," Springer, 2008
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S. M. Alam, R. E. Jones, S. Pozder and A. Jain, "Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology," Quality of Electronic Design, 2009 (ISQED 2009), pp. 569--575, 2009
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C. M. Hung and Y.-L. Lin, "Three-dimensional Integrated Circuits Implementation of Multiple Applications Emphasising Manufacture Reuse", to be publised in IET Computers and Digital Techniques, vol. 5, Iss. 3, pp. 179--185
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Y.-L. Lin, "Chipsburger: From IP/Design Reuse for SOCs to Manufacture Reuse for 3D ICs, "D43D: System Design for 3D Silicon Integration Workshop," June 17--18, 2009, LETI, Grenoble, France
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D. K. Huang, "A TSV-Number-Constrained Bus System Synthesizer for Platform-based 3D IC Design", Thesis, 2010
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J. Minz, Xin Zhao and Sung Kyu Lim, "Buffered Clock Tree Synthesis for 3D ICs Under Thermal Variations," in Proceedings of Asia and South Pacific Design Automation Conference, pp. 504--509, 2008
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Xin Zhao, Sung Kyu Lim, "Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs," Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific, pp. 175--180, 18--21 Jan. 2010
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Tak-Yung Kim and Taewhan Kim, "Clock tree embedding for 3D ICs," in Proceedings of Asia and South Pacific Design Automation Conference, pp. 486--491, 2010
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Xin Zhao, D. L. Lewis, H.-H.S. Lee and Sung Kyu Lim, "Pre-bond testable low-power clock tree design for 3D stacked ICs," in Proceedings of International Conference on Computer-Aided Design, pp. 184--190, 2--5 Nov. 2009
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Ashok Vittal and Malgorzata Marek-Sadowska, "Power Optimal Buffered Clock Tree Design," "Proceedings of the Design Automation Conference (DAC)", pp. 497--502, 1995.
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ISPD 2009 Clock Network Synthesis Contest benchmark. http://ispd.cc/contests/09/ispd09cts.html
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Cited By

View all
  • (2021)Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2021.305830029:4(605-616)Online publication date: Apr-2021
  • (2021)Clock Power Reduction Using NDR RoutingProceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems10.1007/978-981-16-0275-7_50(617-625)Online publication date: 10-Sep-2021
  • (2018)An algorithm for obstacle‐avoiding clock routing tree construction with multiple TSVs on a 3D ICIET Computers & Digital Techniques10.1049/iet-cdt.2018.510513:2(102-109)Online publication date: 27-Nov-2018
  • Show More Cited By

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Published In

cover image ACM Conferences
DAC '12: Proceedings of the 49th Annual Design Automation Conference
June 2012
1357 pages
ISBN:9781450311991
DOI:10.1145/2228360
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Publication History

Published: 03 June 2012

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Author Tags

  1. 3D IC
  2. clock network
  3. clock tree synthesis
  4. through-silicon-via

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  • Research-article

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DAC '12
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DAC '12: The 49th Annual Design Automation Conference 2012
June 3 - 7, 2012
California, San Francisco

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all
  • (2021)Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2021.305830029:4(605-616)Online publication date: Apr-2021
  • (2021)Clock Power Reduction Using NDR RoutingProceeding of Fifth International Conference on Microelectronics, Computing and Communication Systems10.1007/978-981-16-0275-7_50(617-625)Online publication date: 10-Sep-2021
  • (2018)An algorithm for obstacle‐avoiding clock routing tree construction with multiple TSVs on a 3D ICIET Computers & Digital Techniques10.1049/iet-cdt.2018.510513:2(102-109)Online publication date: 27-Nov-2018
  • (2016)2.5D X-Clock Tree Construction Based on Stacked-Layer Combination of Multivoltage Islands2016 International Symposium on Computer, Consumer and Control (IS3C)10.1109/IS3C.2016.118(443-446)Online publication date: Jul-2016
  • (2015)Whitespace-Aware TSV Arrangement in 3-D Clock Tree SynthesisIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2014.235434723:9(1842-1853)Online publication date: Sep-2015
  • (2014)Allocation and optimization of Post-silicon tunable buffers in TSV based heterogeneous 3D ICs2014 International SoC Design Conference (ISOCC)10.1109/ISOCC.2014.7087605(126-127)Online publication date: Nov-2014
  • (2013)Whitespace-aware TSV arrangement in 3D clock tree synthesis2013 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)10.1109/ISVLSI.2013.6654632(115-120)Online publication date: Aug-2013

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