Thermal management is a critical and essential component of maintaining high efficiency and
reliability of electronic components. Adequate cooling must be provided while meeting the …

This paper summarizes a part of the research work done at ARC Seibersdorf research
during the past years related to the development of heat sink materials with tailored …

In order to effectively remove heat load created by oil system, hydraulic system, cabin and
airborne electrical equipment on the aircraft, fuel is selected to be heat sink. Using fuel as heat …

Thermal management of electronics is vital to the successful design, manufacture, and
tactical operation of a variety of military electronic systems. Designs employ all modes of heat …

Thermal management of electronics is a critical part of maintaining high efficiency and
reliability. Adequate cooling must be balanced with weight and volumetric requirements, …

The utility of a synthetic jet ejector for thermal management at low flow rates is discussed. A
synthetic jet ejector typically consists of a primary "zero-mass-flux" unsteady jet driving a …

This study explores the potential of novel boron nitride (BN) microplatelet composites with
combined thermal conduction and electrical insulation properties. These composites are …

This paper presents various thermal management options available for controlled-collapse-chip-connection
(C4) die attached to a ceramic-ball-grid-array substrate (CBGA), as they …

For a given heat sink thermal resistance and ambient temperature, the temperature of an
electronic device rises fairly linearly with increasing device heat flux. This relationship is …

This work deals with a numerical study of natural convection heat transfer around rectangular
heat sink in an inclined enclosure. The effects of the cavity orientation and its length on the …