Making split fabrication synergistically secure and manufacturable
Abstract
Split fabrication is a promising approach to security against attacks by untrusted foundries. While existing split fabrication methods consider the overhead of conventional objectives such as wirelength and timing, they mostly neglect manufacturability---an unavoidable challenge in nanometer technologies. Observing that security and manufacturability can be addressed in a synergistic manner, this work introduces routing techniques that can simultaneously improve both security and manufacturability in terms of either Chemical Mechanical Planarization (CMP) uniformity or Self-Aligned Double Patterning (SADP) compliance. The effectiveness of these techniques is confirmed by experiments on benchmark circuits.
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Making split fabrication synergistically secure and manufacturable
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- CEDA: Council on Electronic Design Automation
- SIGDA: ACM Special Interest Group on Design Automation
- IEEE-CAS: Circuits & Systems
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- IEEE-EDS: Electronic Devices Society
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Published: 13 November 2017
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ICCAD '17
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ICCAD '17: IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN
November 13 - 16, 2017
California, Irvine
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