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A cross-level verification methodology for digital IPs augmented with embedded timing monitors

Published: 24 March 2014 Publication History

Abstract

Smart systems implement the leading technology advances in the context of embedded devices. Current design methodologies are not suitable to deal with tightly interacting subsystems of different technological domains, namely analog, digital, discrete and power devices, MEMS and power sources. The effects of interaction between components and with the environment must be modeled and simulated at system level to achieve high performance. Focusing on the digital domain, additional design constraints have to be considered as a result of the integration of multi-domain subsystems in a single device. The main digital design challenges, combined with those emerging from the heterogeneous nature of the whole system, directly impact on performance and on propagation delay of the digital component. This paper proposes a design approach to enhance the RTL model of a given digital component for the integration in smart systems, and a methodology to verify the added features at system-level. The design approach consists of augmenting the RTL model through the automatic insertion of delay sensors, which can detect and correct timing failures. The augmented model is abstracted to SystemC TLM and, then, mutants (i.e., code mutations for emulating timing failures) are automatically injected into the model. Experimental results demonstrate the applicability of the proposed design and verification methodology and the effectiveness of the simulation performance.

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Cited By

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  • (2019)A Cross-level Verification Methodology for Digital IPs Augmented with Embedded Timing MonitorsACM Transactions on Design Automation of Electronic Systems10.1145/330856524:3(1-23)Online publication date: 11-Mar-2019

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Published In

cover image ACM Other conferences
DATE '14: Proceedings of the conference on Design, Automation & Test in Europe
March 2014
1959 pages
ISBN:9783981537024

Sponsors

  • EDAA: European Design Automation Association
  • ECSI
  • EDAC: Electronic Design Automation Consortium
  • IEEE Council on Electronic Design Automation (CEDA)
  • The Russian Academy of Sciences: The Russian Academy of Sciences

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European Design and Automation Association

Leuven, Belgium

Publication History

Published: 24 March 2014

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DATE '14
Sponsor:
  • EDAA
  • EDAC
  • The Russian Academy of Sciences
DATE '14: Design, Automation and Test in Europe
March 24 - 28, 2014
Dresden, Germany

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Overall Acceptance Rate 518 of 1,794 submissions, 29%

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  • (2019)A Cross-level Verification Methodology for Digital IPs Augmented with Embedded Timing MonitorsACM Transactions on Design Automation of Electronic Systems10.1145/330856524:3(1-23)Online publication date: 11-Mar-2019

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