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Development of a large pixel chip demonstrator in RD53 for ATLAS and CMS upgrades
/ Conti, Elia (CERN) ; Barbero, Marlon (Marseille, CPPM) ; Fougeron, Denis (Marseille, CPPM) ; Godiot, Stephanie (Marseille, CPPM) ; Menouni, Mohsine (Marseille, CPPM) ; Pangaud, Patrick (Marseille, CPPM) ; Rozanov, Alexandre (Marseille, CPPM) ; Breugnon, Patrick (Marseille, CPPM) ; Bomben, Marco (Paris U., VI-VII) ; Calderini, Giovanni (Paris U., VI-VII) et al.
/RD53
RD53A is a large scale 65 nm CMOS pixel demonstrator chip that has been developed by the RD53 collaboration for very high rate (3 GHz/cm$^2$) and very high radiation levels (500 Mrad, possibly 1 Grad) for ATLAS and CMS phase 2 upgrades. It features serial powering operation and design variations in the analog and digital pixel matrix for different testing purposes. [...]
SISSA, 2017 - 5 p.
- Published in : PoS TWEPP-17 (2017) 005
Fulltext: PDF; External link: PoS server
In : Topical Workshop on Electronics for Particle Physics, Santa Cruz, Ca, United States Of America, 11 - 15 Sep 2017, pp.005
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Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC
/ Marconi, S (Marseille, CPPM) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) ; Menouni, M (Marseille, CPPM) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Bomben, M (Paris U., VI-VII) ; Calderini, G (Paris U., VI-VII) et al.
The RD53A large scale pixel demonstrator chip has been developed in 65 nm CMOS technology by the RD53 collaboration, in order to face the unprecedented design requirements of the pixel 2 phase upgrades of the CMS and ATLAS experiments at CERN. This prototype chip is designed to demonstrate that a set of challenging specifications can be met, such as: high granularity (small pixels of 50×50 or 25× 100 µm2) and large pixel chip size (~2x2 cm2), high hit rate (3 GHz/cm2), high readout speed, very high radiation levels (500 Mrad - 1 Grad) and operation with serial powering. [...]
2019 - 4 p.
- Published in : 10.1109/NSSMIC.2018.8824486
In : 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC 2018), Sydney, Australia, 10 - 17 Nov 2018, pp.8824486
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First results from the RD53 ATLAS pixel production readout ASIC (ITkPixV2) for HL-LHC
/ Mironova, Maria (LBNL, Berkeley)
/RD53 Collaboration
The Phase-2 upgrades of ATLAS and CMS for the High-Luminosity LHC (HL-LHC), require a new tracker with robust readout electronics capable of withstanding extreme radiation (1 Grad), a high hit rate (3 GHz/cm2), and a high data rate readout (5 Gb/s). In a joint effort between ATLAS and CMS, pixel detector readout chips have been designed by the RD53 collaboration in 65 nm CMOS technology. [...]
2024 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1068 (2024) 169671
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169671
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RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC
/ Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.-
2024 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
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The RD53A Integrated Circuit
/ Garcia-Sciveres, Maurice (Lawrence Berkeley National Lab. (US))
/RD53 Collaboration
Implementation details for the RD53A pixel readout integrated circuit designed by the RD53 Collaboration. This is a companion to the specifications document and will eventually become a reference for chip users. [...]
CERN-RD53-PUB-17-001.-
Geneva : CERN, 2017 - 73.
RD53A_Manual_V3-51: PDF;
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Design of analog front-ends for the RD53 demonstrator chip
/ Gaioni, L (Bergamo U. ; INFN, Pavia) ; De Canio, F (Bergamo U. ; INFN, Pavia) ; Nodari, B (Bergamo U. ; INFN, Pavia) ; Manghisoni, M (Bergamo U. ; INFN, Pavia) ; Re, V (Bergamo U. ; INFN, Pavia) ; Traversi, G (Bergamo U. ; INFN, Pavia) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Gensolen, F (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) et al.
The RD53 collaboration is developing a large scale pixel front-end chip, which will be a tool to evaluate the performance of 65 nm CMOS technology in view of its application to the readout of the innermost detector layers of ATLAS and CMS at the HL-LHC. Experimental results of the characterization of small prototypes will be discussed in the frame of the design work that is currently leading to the development of the large scale demonstrator chip RD53A to be submitted in early 2017. [...]
SISSA, 2017 - 14 p.
- Published in : PoS Vertex 2016 (2017) 036
Fulltext: PDF; External link: PoS server
In : VERTEX 2016, La Biodola, Italy, 25 - 30 Sep 2016, pp.036
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Extension of RD53
/ ARTECHE GONZALEZ, F ; BACCHETTA, N ; BARBERO, M ; BENKA, T ; BILEI, G ; CALDERINI, G ; CHRISTIAN, D ; CHRISTIANSEN, J ; DEMARIA, L ; GARCIA-SCIVERES, M et al.
The RD53 Collaboration was established in 2013 to develop the next generation of pixel readout chips for the High Luminosity LHC detector upgrades. [...]
CERN-LHCC-2018-028 ; LHCC-SR-008.
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2018.
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