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Article
Report number arXiv:1901.07007 ; CLICdp-Pub-2019-001
Title Time Resolution Studies with Timepix3 Assemblies with Thin Silicon Pixel Sensors
Author(s) Alipour Tehrani, Niloufar (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (Nikhef National institute for subatomic physics (NL)) ; Klempt, Wolfgang (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) ; Nurnberg, Andreas Matthias (KIT - Karlsruhe Institute of Technology (DE)) ; Pitters, Florian Michael (Austrian Academy of Sciences (AT)) ; Spannagel, Simon (CERN) ; Williams, Morag Jean (University of Glasgow (GB))
Publication 2019-05-24
Imprint 2019-01-17
Number of pages 12
In: JINST 14 (2019) P05022
DOI 10.1088/1748-0221/14/05/P05022
Subject category Particle Physics - Experiment ; physics.ins-det ; Detectors and Experimental Techniques
Accelerator/Facility, Experiment CLIC
Study CLICdp
Abstract Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. Both methods are systematically affected by time-walk. In this paper, a method for pixel-by-pixel calibration of the time response is presented. Assemblies of Timepix3 ASICs bump-bonded to thin planar silicon pixel sensors of different thicknesses between 50 μm and 150 μm are calibrated and characterised in particle beams. For minimum ionising particles, time resolutions down to 0.72 ± 0.04 ns are achieved.
Copyright/License preprint: (License: arXiv nonexclusive-distrib 1.0)
publication: © 2019 CERN (License: CC-BY-3.0)



Corresponding record in: Inspire
Email contact: ulrike.schnoor@cern.ch


 Запись создана 2019-01-17, последняя модификация 2024-11-12


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