Abstract
| Recent innovations in the field of silicon imaging technology for consumer applications open extraordinary opportunities for new detector concepts, and hence offer strongly improved physics scope. This document presents a proposal for the construction of a novel vertex detector consisting of curved wafer-scale ultra-thin silicon sensors arranged in perfectly cylindrical layers, featuring an unprecedented low material budget of 0.05 % $X_{0}$ per layer, with the innermost layer positioned at only 18 mm radial distance from the interaction point. This new vertex detector is planned to be installed during the LHC LS3 to replace the innermost three layers of the ALICE Inner Tracking System. It will provide a large reduction of the material budget in the region close to the interaction point and a large improvement of the tracking precision and efficiency at low transverse momentum. The combination of these two improvements will lead to a significant advancement in the measurement of low momentum charmed hadrons and low-mass dielectrons in heavy-ion collisions at the LHC, which are among the main objectives of the ALICE physics programme in the next decade. |