| Published Articles | |
| Report number | AIDA-PUB-2013-030 |
| Title | 3D integration of Geiger-mode avalanche photodiodes aimed to very high fill-factor pixels for future linear colliders |
| Author(s) | Vilella, E (UB) ; Alonso, O (UB) ; Dieguez, A (UB) |
| Publication | 2013 |
| Imprint | 2013-12-11 |
| In: | Nucl. Instrum. Methods Phys. Res., A 731 (2013) pp.103-108 |
| Subject category | Detectors and Experimental Techniques ; 3: Microelectronics and interconnection technology ; 3.2: 3D Interconnection |
| Abstract | This paper presents an analysis of the maximum achievable fill-factor by a pixel detector of Geiger-mode avalanche photodiodes with the Chartered 130 nm/Tezzaron 3D process. The analysis shows that fillfactors between 66% and 96% can be obtained with different array architectures and a time-gated readout circuit of minimum area. The maximum fill-factor is achieved when the two-layer vertical stack is used to overlap the non-sensitive areas of one layer with the sensitive areas of the other one. Moreover, different sensor areas are used to further increase the fill-factor. A chip containing a pixel detector of the Geigermode avalanche photodiodes and aimed to future linear colliders has been designed with the Chartered 130 nm/Tezzaron 3D process to increase the fill-factor. |
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Email contact: sabrina.el.yacoubi@cern.ch
Record created 2015-03-10, last modified 2018-07-30